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CHIPS for America - Creating Inclusive Opportunities for ...
Components: • Attract large-scale investments in advanced technologies such as leading-edge logic and memory • Incentivize expansion of manufacturing capacity for mature and other types of semiconductors
NIST 超额完成了 CHIPS 的招聘目标，但未制定全面的劳动力计划
《CHIPS法案》为商务部提供了500亿美元。其中390亿美元用于激励对美国设施和设备的投资。剩余的110亿美元用于建立强大的国内研发生态系统，并监督一系列旨在加强和振兴美国在半导体研发和制造领域地位的项目。此外，《CHIPS法案》还授权商务部长发放高达750亿美元的直接贷款和贷款担保。商务部正在通过国家标准与技术研究所（NIST）实施这些要求，该研究所推动测量科学、标准和技术的发展，以促进美国创新、提高工业竞争力并提高经济安全和生活质量。
CHIPS for America：支持美国半导体供应链和劳动力的联邦计划
国防部：美国国防基金的 CHIPS 国防部正在管理 20 亿美元来实施微电子公共项目，这是一个由 CHIPS 和科学法案资助的国家网络，用于在岸、微电子硬件原型设计、半导体技术从实验室到晶圆厂的过渡以及半导体劳动力培训。国防部于 2023 年 9 月宣布了第一批奖项：向全国八个区域“创新中心”提供近 2.4 亿美元。这些中心将成为国防部和美国推动国内微电子制造业发展的努力的一部分。国防部牵头的微电子公共项目旨在实现大规模商业可行性的展示，这对于缩小目前大学、小企业和其他实验室创新与市场采用之间的差距是必需的，这种差距阻碍了最好的技术创意进入市场。
CHIPS Act and its Impact on the Compound Semiconductor Industry Melissa Grupen-Shemansky, PhD 1 1 CTO and VP of Technology Communities, SEMI, megsh
CHIPS Act and its Impact on the Compound Semiconductor Industry Melissa Grupen-Shemansky, PhD 1 1 CTO and VP of Technology Communities, SEMI, megshemansky@semi.org Keywords: CHIPS, Manufacturing, Workforce, Supply Chain, Compound Semiconductor, Government Abstract SEMI, in their 50+ years of operation, has been a trade organization supporting the semiconductor manufacturing industry with a strong membership population consisting of materials and equipment suppliers from its onset. In the mid 90's, membership jumped and SEMI broadened their scope to include member companies from across the semiconductor manufacturing supply chain, such as IDMs (integrated device manufacturers), foundries (outsource fabrication service suppliers), and EDA (electronic design automation) suppliers. We have not deviated from our base, but have added membership from across the supply chain recognizing the increasing complexity of the microelectronics ecosystem and the increasing demand for co-design and cross-collaboration of the various semiconductor disciplines at the earliest stages of development. The semiconductor industry has experienced various inflection points over the last several decades, but perhaps none so disruptive as the present. We will look into how the semiconductor industry in general has captured the attention of the person on the street and how the industry disruptions will lead to opportunities for compound semiconductors. The U.S. CHIPS and Science Act will accelerate More than Moore technologies which in turn will further enable the integration of compound semiconductors to capitalize on the unique properties of these materials. Breakthrough opportunities will emerge with the emerging technologies developed in the Microelectronics Commons as well as the priorities of the National Semiconductor Technology Center (NSTC) and closely coupled National Advanced Packaging Manufacturing Program (NAPMP) in the CHIPS Act R&D office. A rapid focus on those technologies essential to U.S. market leadership will ensue. We will examine the emerging priorities within the CHIPS Act programs and discuss the critical role compound semiconductors play in the leap ahead technologies as well as the potential supply chain vulnerabilities that need to be addressed. I NTRODUCTION As the semiconductor industry prepared to navigate a dramatic change to the traditional linear shrink roadmap that had affirmed Moore's Law for the last 40 years, the COVID pandemic hit. Most people, companies, and countries were caught off guard and ill-prepared. In a rush to save lives,
CHIPS CVDP 指南及相关知识产权保护
• 申请人还可以确定如何最大限度地发挥所资助创新的市场优势，例如降低制造成本、提高产量或解决性能、可用性或符合技术或环境标准的问题。（NAPMP M&S NOFO 4.6.1.6.d.vi）
CHIPS 研发安全与技术保护
在进行评估时，NIST 将考虑多种因素，例如将要进行的研究类型（例如基础研究与专有研究）、潜在的双重用途应用（例如军事和民用）以及研究合作的好处。NIST 还将审查可用信息（例如当前和待处理的支持表格和简历）以评估申请人或任何涵盖的个人是否受到外国战略竞争对手或有知识产权盗窃、研究不端行为或针对美国技术进行未经授权转让历史的国家政府的不当外国影响或干涉。如果 NIST 研究安全和保障国际科学团队发布申请存在高风险的风险判定，NIST 可自行决定在 CHIPS R&D 对申请做出最终资助决定之前为申请人提供减轻评估风险的机会。该研究安全评估将根据资助机会中定义的评估标准，与 CHIPS R&D 评估分开进行。
CHIPS 研发商业可行性和国内生产 (CVDP) 计划指南
本指南仅供参考，仅旨在帮助潜在申请人更好地了解 CHIPS 研发申请要求。本指南不会、也不旨在取代、修改或以其他方式改变适用的法定或监管要求或任何 CHIPS 研发资助机会通知 (NOFO) 中规定的具体要求。在任何情况下，法定和监管要求以及相关 NOFO 中规定的要求应优先于本指南中包含的任何不一致之处。
CHIPS 技术保护指南
国会和行政部门都试图保护联邦资助的研究和知识产权。2021 年 1 月发布的《国家安全总统备忘录-33》（NSPM-33）旨在“加强对美国政府支持的研发的保护，防止外国政府的干涉和利用”。NSPM-33 对联邦资金接受者提出了披露要求，寻求标准化各机构的报告要求，并要求每年获得超过 5000 万美元联邦研发资金的组织实施自己的研究安全计划。这些研究安全计划必须解决网络安全、出国旅行安全、内部威胁意识和识别，以及适当的出口管制培训。与此同时，国会将某些披露要求制定成法律 1，要求申请联邦研发资金的“受保个人”披露所有当前和待定研究支持的金额、类型和来源，包括货币支持和非货币支持。