EGDME

XLM超级电容器模块数据表

Sawn wafers delivered with tape and ring DEHP Microelectromechanical systems sensors Diboron Trioxide glass, Lead Oxide glass Optical sensors Diboron Trioxide glass Glucose sensors Diboron Trioxide glass Devices in glass sealed packages Diboron Trioxide glass Integrated Passive Devices on glass Diboron Trioxide glass Network infrastructure devices Diboron Trioxide glass IPADs with PZT film capacitances on dice Lead Titanium Zirconium oxide Triacs with glass groove technology (fritted glass on die) Lead Oxide glass Glass-sealed diodes and diacs Lead Oxide glass Micromodules Hexahydromethylphthalic anhydride Plastic Module Nonylphenol resin, EGDME Battery Attached Nonylphenol resin, EGDME Battery Caphat Nonylphenol resin, EGDME Battery Snaphat Nonylphenol resin, EGDME Microcontroller evaluation boards containing battery EGDME Semiconductor on BGA and LGA substrate packages BisphenolA Semiconductor on flip chip packages Lead in metal form RoHS exemption 15-15a / ELV exemption 8g Power Devices金属形式的铅ROHS豁免7A/ELV豁免8E在TIN/LEAD BALS套件上的半导体铅在金属形式的半导体中，在TIN/LEAD基于铅的涂层连接铅上，金属形式ELV豁免8A