两种最常见的微芯片架构类型是专用集成电路 (ASIC) 和现场可编程门阵列 (FPGA)。ASIC 是量身定制的,专为特定目的而设计和优化,具有优化该应用的性能和效率的优势。GPU 是一个常见的例子。另一方面,FPGA 则更为通用,它牺牲了对任何一种应用的优化,以在更广泛的应用中获得更大的规模经济。正如“现场可编程”所暗示的那样,FPGA 更适合需要不断更新算法的应用,例如无线通信和驾驶辅助系统。2 在国防领域,FPGA 常见于声纳和雷达等应用的信号处理板上。3 然而,这种明确的区别在实践中往往很模糊,因为 FPGA 越来越多地针对人工智能 (AI) 或 5G 等更具体的应用进行量身定制,并且这两种芯片架构在复杂性和精密性方面都涵盖了广泛的产品。
随着强大技术的出现,微电子已成为我们日常生活中不可或缺的一部分。它们还用于医疗保健、环境监测、机器人或娱乐等广泛领域。这门微电子入门课程是为物联网 (IoT) 量身定制的,它教授如何使用微电子电路通过传感器与环境交互并与其他设备进行无线通信。它涵盖了传感器接口的评估和实现、数据转换、信号处理和设备通信等主题。这门定制课程自下而上,从介绍物联网微电子的基本构建块开始。然后,接着是系统和架构接口考虑。最后,学生有机会基于可用的微电子模块实现一个基本的物联网系统。本课程旨在为物联网应用提供关键微电子构建块的基本概念。学生将通过实际设计示例和案例研究获得使用可用微电子模块的实践经验。
这份由标准政策跨部门委员会 (ICSP) 半导体和微电子工作组编写的报告概述了联邦政府半导体和微电子标准活动,并推荐了 ICSP 考虑的标准重点领域和优先事项。报告的“向 ICSP 提出的战略标准重点领域的建议”部分列出了联邦政府目前参与的与半导体和微电子相关的标准制定组织,确定了五个重点领域和优先事项,并确定了未来可能产生影响的差距和机会。概况回顾部分概述了每个参与机构的相关半导体和微电子标准活动,包括其使命、半导体和微电子目标、参与标准制定组织、半导体和微电子重点领域和优先事项以及半导体和微电子差距和机会。国家关键新兴技术标准战略表明了半导体和微电子工作组如何与国家关键新兴技术标准战略保持一致。
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FOR IMMEDIATE RELEASE Silicon Crossroads Microelectronics Commons Marks Milestone Year CRANE, Ind. – As 2024 comes to a close, the Silicon Crossroads Microelectronics Commons (SCMC) Hub has emerged as a powerful catalyst for innovation and growth in the Midwest's microelectronics ecosystem. Under the leadership of Applied Research Institute (ARI), the hub has made substantial strides in fostering collaboration, driving technological advancements, and nurturing talent. SCMC is poised to help shape the future of microelectronics, strengthening America's global competitiveness and driving economic and national security. In its first year, SCMC focused on standing up its internal operations, and established a robust and diverse membership base spanning academia, small businesses, industry leading commercial companies and defense industrial base system integrators. This vibrant community was integral to driving ideation, advancing technologies through prototyping, and positioning projects for efficient transition to production. SCMC innovation processes and framework has made significant strides to accelerate microelectronics technology advancements through the proven innovation architecture. The nucleus of this framework incorporates collaborative ideation sessions, networking collisions, innovation templates/best practices, and the convergence of project teams. For example, SCMC's collaborative ideation sessions, such as the one held in June 2024, are designed to reduce innovation barriers. SCMC implemented a suite of tools, revolutionizing the operational capabilities. With these tools, the SCMC Hub can communicate efficiently, ensuring clear and timely information exchange among all members. This improved communication has resulted in better teaming opportunities, enabling more cohesive and strategic collaborations. The online member engagement platform houses all hub engagement, outreach, communications, event calendar, teaming profiles, member resources, data calls, and membership data. By utilizing this platform, SCMC members can interact with other hub members, receive pertinent Hub communications, partner with new innovative companies, share noteworthy news/articles, view announcements, and explore upcoming events. Upon the launch of this platform, our membership base consisted of 136 members, but saw significant and constant growth each quarter, bringing us to over 250 members, an 83% increase. Members can utilize the newly opened Silicon Crossroads Collaboration Center (SC3), which serves as a state-of-the-art hub for the SCMC, providing a modern and flexible space to foster collaboration, innovation, and knowledge sharing among the hub's diverse membership. The center's modular design accommodates a variety of events, workshops, and meetings, and already hosted over 36 activities that brought in more than 800 members and ecosystem partners. As a central gathering place for the three-state hub coalition, the SC3 plays a vital role in enabling the rich engagement and community-building that are critical to the hub's success. One of the most notable in 2024 was the establishment of the R1 Nucleus (R1N), an unprecedented collaboration between four prestigious regional universities: Purdue University, University of Notre Dame, University of Michigan, and University of Illinois Champaign- Urbana.
NIST 的前身国家标准局 (NBS) 于 20 世纪 50 年代中期开始致力于满足新兴半导体行业的测量需求。虽然这项工作最初侧重于其他政府机构的晶体管应用,但在 20 世纪 60 年代初,该局向美国材料与试验协会 (ASTM) 和美国电子工业协会 (EIA) 寻求行业指导。ASTM 的首要任务是准确测量硅的电阻率。NBS 的科学家开发了一种实用的无损测量方法,其精度比以前的破坏性方法高出 10 倍。该方法是五种工业标准和广泛用于校准行业测量仪器的电阻率标准参考材料的基础。第二个项目由 EIA 专家小组推荐,旨在解决晶体管的“二次击穿”故障机理。该项目的成果得到了广泛应用,包括解决导致航天飞机发射延迟的主发动机控制问题。