Sawn wafers delivered with tape and ring DEHP Microelectromechanical systems sensors Diboron Trioxide glass, Lead Oxide glass Optical sensors Diboron Trioxide glass Glucose sensors Diboron Trioxide glass Devices in glass sealed packages Diboron Trioxide glass Integrated Passive Devices on glass Diboron Trioxide glass Network infrastructure devices Diboron Trioxide glass IPADs with PZT film capacitances on dice Lead Titanium Zirconium oxide Triacs with glass groove technology (fritted glass on die) Lead Oxide glass Glass-sealed diodes and diacs Lead Oxide glass Micromodules Hexahydromethylphthalic anhydride Plastic Module Nonylphenol resin, EGDME Battery Attached Nonylphenol resin, EGDME Battery Caphat Nonylphenol resin, EGDME Battery Snaphat Nonylphenol resin, EGDME Microcontroller evaluation boards containing battery EGDME Semiconductor on BGA and LGA substrate packages BisphenolA Semiconductor on flip chip packages Lead in metal form RoHS exemption 15-15a / ELV exemption 8g Power Devices金属形式的铅ROHS豁免7A/ELV豁免8E在TIN/LEAD BALS套件上的半导体铅在金属形式的半导体中,在TIN/LEAD基于铅的涂层连接铅上,金属形式ELV豁免8A
非常关注的物质CAS编号斑马产品类型(S)Nonylphenol,乙氧基化9016-45-9 10033647RM(8000D可溶解),EXP20773T 6,6'-di-di-di-di-ti-tert-tert-butyl-2,2,2'-甲基 - 甲基二甲基二 - 甲基二糖119-19-47-19-47-1 POROOOOOOOOOOOOOOOOOEAEA,EMAEA(EMEA) 4,4'-磺胺二苯酚(双酚S)80-09-1 EXP26228D,Z-Perform 1000D Z-Perform 1000D高钉Z-Perform 1000D-E Zebra供应项目在下面列出颜色): * - 表示EMEA特定产品
1简介4 2法律背景4 2.1鹿特丹公约5 2.2斯德哥尔摩公约和POPS条例6 2.3达到法规6 2.4 PIC法规6 3 3分析3 3 3.1统计数据9 3.2兴趣群及其监管状态10 3.2.2.2.1.2.1 tetraethyl lead 15 3.2.4 Organotin compounds: Dioctyltin, dibutyltin and tributyltin compounds 16 3.2.5 Flame retardants: Polybrominated biphenyls 17 3.2.6 Per- and polyfluoroalkyl substances 17 3.3 Discussion 18 4 Effects and pathways of exported chemicals 19 4.1 Case study: Nonylphenols and nonylphenol ethoxylates 19 4.2案例研究:有机素化合物20 5公司可持续性尽职调查指令21 6结论22出版参考书目23 I附录29