行星的形成通常发生在星团中,恒星的飞越和相遇在其中起着重要作用。这些相遇产生的潮汐扰动会在原行星盘内诱发结构,例如螺旋臂和扭曲区域。该项目旨在通过利用盖亚目录数据识别过去涉及行星形成盘的相遇事件,量化这些恒星相遇对行星形成的影响。具体来说,学生将根据盖亚提供的初始位置和速度,通过整合恒星的轨道来识别潜在的近距离相遇。然后,学生将使用分析模型研究这些相遇如何影响盘的演化。最终,学生将解决在行星盘中观察到的子结构是否是过去相遇的结果,并评估此类相遇在行星形成中的作用。
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
1. 请注意,申请带“*”专业的学生将首先被归类为普通类专业。入学后,学校将为您分配具体专业。 2. 申请者可以访问以下网站https://i.sjtu.edu.cn/jxzxjhgl/pyjhxxcx_cxPyjhxxIndex.html#查看上一学年的课程安排。
Romans 13:8-10 Romans 14:1-4 Romans 15:13 Romans 16:20 Psalm 14:1-3 - 1 Corinthians 1:18-21 1 Corinthians 2:9 1 Corinthians 3:16-17 1 Corinthians 4:3-5 1 Corinthians 5:9-13 Psalm 15:1-5 - 1 Corinthians 6:15-20 1 Corinthians 7:17 1 Corinthians 8:4-6 1 Corinthians 9:19-23 1 Corinthians 10:31-33 Psalm 16:8-11 - 1 Corinthians 11:23-26 1 Corinthians 12:14-20 1 Corinthians 13:8-13 1 Corinthians 14:1-3 1 Corinthians 15:1-11 Psalm 17:6-9 - 1 Corinthians 16:21-24 2 Corinthians 1:3-5 2哥林多前书2:12-13
Table 1. Read/Write Performance .................................................................................................................................................. 1 Table 2. Capacity according to partition .......................................................................................................................................... 1 Table 3. Ordering Information ......................................................................................................................................................... 1 Table 4. Ball Descriptions ............................................................................................................................................................... 6 Table 5. OCR Register ................................................................................................................................................................... 7 Table 6. CID Register ..................................................................................................................................................................... 7 Table 7. CSD Register .................................................................................................................................................................... 8 Table 8. Extended CSD Register .................................................................................................................................................... 9 Table 9. Bus Signal Levels ........................................................................................................................................................... 14 Table 10. High-Speed Device Interface Timing ............................................................................................................................ 16 Table 11. Backward Compatible Device Interface Timing............................................................................................................. 17 Table 12. High-speed Dual Data Rate Interface Timing ............................................................................................................... 19 Table 13. HS200 Device Clock Timing ......................................................................................................................................... 20 Table 14. HS200 Device Input Timing .......................................................................................................................................... 21 Table 15. HS200 Device Output Timing........................................................................................................................................ 22 Table 16. HS400 Device Input Timing .......................................................................................................................................... 24 Table 17. HS400 Device Output Timing........................................................................................................................................ 25 Table 18. Bus Signal Line Load .................................................................................................................................................... 26 Table 19. HS400 Capacitance and Resistors ............................................................................................................................... 26 Table 20. Supply Voltage .............................................................................................................................................................. 27 Table 21. Power Consumption ...................................................................................................................................................... 27 Table 22. Push-pull signal level - high-voltage.............................................................................................................................. 28 Table 23. Push-pull signal level - 1.70V-1.95V V CCQ voltage range .............................................................................................. 28
•ESJTP无法满足其既定目的,并且没有提供提供苏格兰能源系统正义过渡所需的具体路由。•随着能源费用飙升,气候目标错过了,约伯有望破坏;更多的目标没有细节的方式实现,这是不可接受的。•一家公共能源公司和更大的地方当局拥有能源的所有权对于保留能源过渡的好处,支持地方供应链并在苏格兰创造就业机会至关重要。•对于当今行业的工人来说,几乎没有信心,即将到来的过渡将经过良好的管理,并根据此ESJTP保护他们的生计。对于社区,它几乎无法涉及他们所期望的影响。•ESJTP未能概述必要的基本步骤,以确保通过降低北海石油和天然气的生产,包括资助的过渡支持,培训计划或工作和技能审核,以确保海上石油和天然气工人的公正过渡。•几乎没有关于未来能源供应与需求相关的几乎没有认真的分析,而净零能源系统中的能量储存的至关重要挑战也没有解决。•ESJTP是在能源领域优先考虑内向投资和私有化的失败方法的延续。苏格兰政府将如何在苏格兰社区中创造就业机会并保持福利的同时如何实现能源野心。
1. 请注意,申请带“*”专业的学生将首先被归类为普通类专业。入学后,将根据学院的指示分配到具体专业。 2. 申请人可以访问以下网站https://i.sjtu.edu.cn/jxzxjhgl/pyjhxxcx_cxPyjhxxIndex.html#查看上一学年的课程安排。