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FC51L08SFY3A eMMC 闪存 3.3V 8 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25°C~85°C），存储（-40°C~85°C） 用户密度：
FC51L04SMSA eMMC 闪存 3.3V 4 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25 ℃ ~85 ℃），存储（-40 ℃ ~85 ℃） 用户密度：
FC51L04SFSA (2A) eMMC 闪存 3.3V 4 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25°C~85°C），存储（-40°C~85°C） 用户密度：
eMMC 组件 - 面向设备制造商的嵌入式多媒体卡
金士顿 eMMC™ 是一种嵌入式非易失性内存系统，由闪存和闪存控制器组成，可简化应用程序接口设计，并使主机处理器摆脱低级闪存管理。eMMC 是许多消费电子设备（包括智能手机、平板电脑和移动互联网设备）的流行存储组件。它越来越多地被许多工业和嵌入式应用所采用。
FC51J16SJTS1SA (2CQ) eMMC Flash 3.3V 16 Gbyte ( ...
Table 1. Read/Write Performance .................................................................................................................................................. 1 Table 2. Capacity according to partition .......................................................................................................................................... 1 Table 3. Ordering Information ......................................................................................................................................................... 1 Table 4. Ball Descriptions ............................................................................................................................................................... 6 Table 5. OCR Register ................................................................................................................................................................... 7 Table 6. CID Register ..................................................................................................................................................................... 7 Table 7. CSD Register .................................................................................................................................................................... 8 Table 8. Extended CSD Register .................................................................................................................................................... 9 Table 9. Bus Signal Levels ........................................................................................................................................................... 14 Table 10. High-Speed Device Interface Timing ............................................................................................................................ 16 Table 11. Backward Compatible Device Interface Timing............................................................................................................. 17 Table 12. High-speed Dual Data Rate Interface Timing ............................................................................................................... 19 Table 13. HS200 Device Clock Timing ......................................................................................................................................... 20 Table 14. HS200 Device Input Timing .......................................................................................................................................... 21 Table 15. HS200 Device Output Timing........................................................................................................................................ 22 Table 16. HS400 Device Input Timing .......................................................................................................................................... 24 Table 17. HS400 Device Output Timing........................................................................................................................................ 25 Table 18. Bus Signal Line Load .................................................................................................................................................... 26 Table 19. HS400 Capacitance and Resistors ............................................................................................................................... 26 Table 20. Supply Voltage .............................................................................................................................................................. 27 Table 21. Power Consumption ...................................................................................................................................................... 27 Table 22. Push-pull signal level - high-voltage.............................................................................................................................. 28 Table 23. Push-pull signal level - 1.70V-1.95V V CCQ voltage range .............................................................................................. 28
FC51J16SJTS1A (2AF) eMMC 闪存 3.3V 16 Gbyte ...
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
FC51J64SJTS1A (2C) eMMC 闪存 3.3V 64 Gbyte ...
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
材料2030宣言
EMMC协会及其广泛的社区一直在迈向这一目标，即在建立高度跨学科的生态系统中团结数字和材料能力和能力。EMMC融合了建模和数字化进步的许多方面，以加速材料的开发和制造。因此，EMMC社区在解决宣言中概述的挑战方面处于最前沿，例如“必须在材料开发中应用数字创新”，“对于欧洲来说，创建一个独特的世界生态系统至关重要的是，与Discovery-Discovery领导的L OW-OW-OW-OW-OWRE搜索与应用方向联系并链接IT与行业链接链接是至关重要的。”EMMC及相关项目的关键发展包括前进和集成的建模和创新平台，这些平台基于互操作性和本体论，以支持行业5.0过渡。emmc准备通过EMMC社区通过EMMC社区的深厚而多样的建模和数字化能力做出合并战略路线图来做出响应，从而支持高级材料的敏捷和包容性的欧洲治理，并为一个新颖的欧洲欧洲战略下一代高级材料制定了一个为实现一个可持续社会的绘制。
myc-ya157c CPU模块
仅测量45mm x 43mm，Myc-YA157 CPU模块是一个紧凑的ST STM32MP1驱动的System-On模块（结合了STM32MP157处理器的SOM（SOM），STM32MP157AAC3），512MB DDR3，4GB EMMC EMMC EMMC以及一个集成的gige。通过1.0毫米螺距164针孔孔（Castellated-Hole）扩展接口带出许多外围设备和IO信号，使模块成为系统集成的出色嵌入式控制器。典型的应用是工业控制，消费电子，智能家居，医疗以及其他节能应用，图1-2 Myc-Ya157c CPU模块需要丰富的性能和低功率。
HB368F21-6412-AI数据表
3 x DP (Max Resolution: 4096×2160@60Hz) MULTIPLE DISPLAY Support 3 Displays Support 3 Displays ETHERNET 2 x GbE 2 x GbE I/O 2 x RJ45 2 x RJ45 I/O 2 x USB 3.2 Gen 2 2 x USB 3.2 Gen 2 I/O 5 x USB 2.0 5 x USB 2.0 I/O 2 x RS-232/422/485 2 x RS-232/422/485 I/O 1 x GPIO 1 x GPIO I/O 1 x Audio (Line-out, MIC) 1 x Audio (Line-out, MIC) I/O 1 x Line-in 1 x Line-in I/O 1 x GND Hold 1 x GND Hold I/O 1 x DC Jack 1 x DC Jack eMMC eMMC 64GB eMMC 64GB M.2 1 x E-Key 2230 1 x E-KEY 2230 M.2 1 X B-KEY 2242/3042/3052 1 X B-KEY 2242/3042/3052 M.2 1 X HAILO-8 M关键模块1 X HAILO-8 M 8 M KEY模块其他WiFi操作温度-20°C〜70°C〜70°C（-4°F〜158°F）-20°F）-20°°f）70°°°C〜