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FC51J64SJTS1A (2C) eMMC 闪存 3.3V 64 Gbyte ...
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
FC51J16SJTS1A (2AF) eMMC 闪存 3.3V 16 Gbyte ...
表 1. 读/写性能 ................................................................................................................................................................ 1 表 2. 分区容量 ................................................................................................................................................................ 1 表 3. 订购信息 ................................................................................................................................................................ 1 表 4. 球描述 ................................................................................................................................................................ 6 表 5. OCR 寄存器 ............................................................................................................................................................. 7 表 6. CID 寄存器 ............................................................................................................................................................. 7 表 7. CSD 寄存器 ............................................................................................................................................................. 8 表 8. 扩展 CSD 寄存器 ................................................................................................................................................ 9 表 9. 总线信号电平 ................................................................................................................................................ 14 表 10. 高速设备接口时序 ................................................................................................................................................ 16 表 11. 向后兼容设备接口时序 ................................................................................................................................ 17 表 12. 高速双数据速率接口时序................................................................................................................................ 19 表 13. HS200 器件时钟时序.............................................................................................................................................. 20 表 14. HS200 器件输入时序................................................................................................................................................ 21 表 15. HS200 器件输出时序............................................................................................................................................. 22 表 16. HS400 器件输入时序............................................................................................................................................. 24 表 17. HS400 器件输出时序........................................................................................................................................................................................ 25 表 18. 总线信号线负载 ...................................................................................................................................................... 26 表 19. HS400 电容和电阻 ............................................................................................................................................. 26 表 20. 电源电压 ............................................................................................................................................................. 27 表 21. 功耗 ............................................................................................................................................................. 27 表 22. 推挽信号电平 - 高电压 ............................................................................................................................................. 28 表 23. 推挽信号电平 - 1.70V-1.95VV CCQ 电压范围 ............................................................................................. 28
FC51L04SFSA (2A) eMMC 闪存 3.3V 4 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25°C~85°C），存储（-40°C~85°C） 用户密度：
FC51J16SJTS1SA (2CQ) eMMC Flash 3.3V 16 Gbyte ( ...
Table 1. Read/Write Performance .................................................................................................................................................. 1 Table 2. Capacity according to partition .......................................................................................................................................... 1 Table 3. Ordering Information ......................................................................................................................................................... 1 Table 4. Ball Descriptions ............................................................................................................................................................... 6 Table 5. OCR Register ................................................................................................................................................................... 7 Table 6. CID Register ..................................................................................................................................................................... 7 Table 7. CSD Register .................................................................................................................................................................... 8 Table 8. Extended CSD Register .................................................................................................................................................... 9 Table 9. Bus Signal Levels ........................................................................................................................................................... 14 Table 10. High-Speed Device Interface Timing ............................................................................................................................ 16 Table 11. Backward Compatible Device Interface Timing............................................................................................................. 17 Table 12. High-speed Dual Data Rate Interface Timing ............................................................................................................... 19 Table 13. HS200 Device Clock Timing ......................................................................................................................................... 20 Table 14. HS200 Device Input Timing .......................................................................................................................................... 21 Table 15. HS200 Device Output Timing........................................................................................................................................ 22 Table 16. HS400 Device Input Timing .......................................................................................................................................... 24 Table 17. HS400 Device Output Timing........................................................................................................................................ 25 Table 18. Bus Signal Line Load .................................................................................................................................................... 26 Table 19. HS400 Capacitance and Resistors ............................................................................................................................... 26 Table 20. Supply Voltage .............................................................................................................................................................. 27 Table 21. Power Consumption ...................................................................................................................................................... 27 Table 22. Push-pull signal level - high-voltage.............................................................................................................................. 28 Table 23. Push-pull signal level - 1.70V-1.95V V CCQ voltage range .............................................................................................. 28
eMMC 组件 - 面向设备制造商的嵌入式多媒体卡
金士顿 eMMC™ 是一种嵌入式非易失性内存系统，由闪存和闪存控制器组成，可简化应用程序接口设计，并使主机处理器摆脱低级闪存管理。eMMC 是许多消费电子设备（包括智能手机、平板电脑和移动互联网设备）的流行存储组件。它越来越多地被许多工业和嵌入式应用所采用。
FC51L08SFY3A eMMC 闪存 3.3V 8 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25°C~85°C），存储（-40°C~85°C） 用户密度：
FC51L04SMSA eMMC 闪存 3.3V 4 Gbyte ...
兼容 JEDEC 嵌入式多媒体卡（eMMC）电气标准（5.1） 数据总线宽度：1bit（默认）、4bit 和 8bit 不支持大扇区大小（4KB） 接口电源：V CCQ（1.70V~1.95V 或 2.7V~3.6V），存储器电源：V CC（2.7V~3.6V） 温度：工作（-25 ℃ ~85 ℃），存储（-40 ℃ ~85 ℃） 用户密度：