XiaoMi-AI文件搜索系统
World File Search Systemjoining
2023综合和可持续性年度报告
Block 1: Understanding Grifols We address the needs of thousands of patients..................................................... 12 Joining forces with Biotest.................................................................................... 13 Our global footprint.............................................................................................. 14 Our business model creates value......................................................................... 16 Sustainability and human rights.............................................................................18 Grifols' value chain............................................................................................... 36 Donors and patients............................................................................................. 52 Innovation at Grifols............................................................................................. 72
2024 IBC宪章 - UW环境健康与安全
Recombinant or synthetic nucleic acids : Defined in the National Institutes of Health "NIH Guidelines for Research Involving Recombinant or Synthetic Nucleic Acid Molecules" Current definition: "In the context of the NIH Guidelines , recombinant or synthetic nucleic acids are defined as: (i) molecules that a) are constructed by joining nucleic acid molecules and b) that can在活细胞中复制，即重组核酸；（ii）核酸分子是化学或通过其他方式合成或放大的，包括化学或其他修饰的核酸分子，但可以与自然发生的核酸分子配对。 多于。”
利用CRISPR/Cas9基因编辑技术治疗β-地中海贫血的最新进展
dsDNA 或 ssODN 作为模板进行精确修复 , 而非同源末端连接 (NHEJ) 介导的随机修复可造成插入 、 缺失或突变 . ssODN: 单链寡核苷酸 ; dsDNA: 双链 DNA Figure 3 Two CRISPR/Cas9 gene editing strategies. Cas9 creates DNA double strand break at three bases upstream of the PAM sequence. Homologous recombination repair (HDR) mediates precise repair using dsDNA or ssODN as a template, while non-homologous end joining (NHEJ) -mediated repair can cause insertion, deletion or mutation. ssODN: Single-strand oligodeoxynucleotide; dsDNA: Double strand DNA
Vision and Strategy 2030
Attracting students: Our Campus Heart Programme is transforming student spaces, which are the centre of our community. We are welcoming more students from state schools, who made up over 76% of our recent intake, up from 61% in 2015. A new contextual offers system has seen 33% of those students joining us from aspiring state schools, up from 21% in 2015. By improving access for high-potential students from the local community, the Bristol Scholars programme has recruited 218 students – 28 of whom have graduated, with 21% obtaining a first-class degree. Our Bristol Futures Curriculum Framework is now university-wide, improving students' experience of assessment and feedback through the internationally renowned TESTA process.
May 2024 Space Business Review
May Investment Activity May 29 – Verizon, Inc. (Verizon) announced that it plans to invest $100m in direct-to-device company AST SpaceMobile Inc. (AST SpaceMobile), consisting of $65m in commercial pre- payments and $35m in debt. Verizon plans to leverage AST SpaceMobile's satellite network to improve cellular coverage in remote areas of the United States. Earlier, on May 16, AST SpaceMobile entered into an agreement with AT&T Inc. to provide space-based connectivity services for its U.S. network. May 29 – Canadian space and robotics company MDA Space, Inc. (MDA) and commercial space station joint venture Starlab Space LLC (Starlab) announced that MDA is joining Starlab alongside existing joint venture partners Voyager Space Holdings, Inc. , Airbus Defence and Space and Mitsubishi Corporation . MDA will provide robotics expertise and solutions to Starlab, which plans to launch its first space station in 2028.
ETME - 机械工程技术
ETME 311 连接工艺：3 个学分（1 个讲座，2 个实验室）先决条件：EMEC 103、CHMY 121IN 和 CHMY 122IN 或 CHMY 141 和 CHMY 142。（F，Sp）介绍现代连接技术科学，详细检查与连接工艺相关的冶金学和材料特性。介绍焊接规范和符号以及现代焊接规范的使用。强调焊接设计、设置、准备、应用和测试。实验室包括 OAW、SMAW、GMAW、GTAW、常见分离工艺的具体动手体验；破坏性和非破坏性测试。本课程还将让学生了解工业中使用的其他紧固连接技术。将探讨电阻焊、复合材料、铆接和机械紧固及其应用
第14届Jena Laser会议
在此贡献中，提出了向金属透明材料的超快激光焊接。探索了将硼曲叶玻璃B33与Ti/Al6/V4连接到Ti/Al6/V4的激光脉冲能量，扫描速度和燃烧延迟依赖性，并实现了最大的剪切连接强度> 6 MPa，从而可以预见各种应用。探索对热周期的电阻率，将样品加热到不同的温度，并在冷却后测量残留的剪切连接强度。对于超过120°C的温度，连接的故障被发现。接下来证明了将融合二氧化硅与具有适应性疗法膨胀系数的金属相连的金属，以提高热周期稳定性。高点这种连接方法的普遍适用性，在此显示了半导体对金属的焊接，此处用硅和铜进行了说明。在窄带间隙半导体材料中，需要考虑使用高强度激光脉冲的非线性传播来优化界面处的沉积能量并增强所得连接。实现了最大的剪切连接强度> 2 MPa，证明了工业兼容性。
法院室2号日：星期二日期：11.03.2025 ...
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