基于环氧的成型化合物(EMC)被广泛用于封装汽车电子产品。在高温运行下,EMC被氧化并在机械性能中经历降解。这可以改变封装的电子组件的热机械行为,从而影响其可靠性。Three key aspects of EMC oxidation in the context of microelectronics reliability are pre- sented in this paper – (1) degradation of EMC specimens is studied under high temperature aging at three different temperatures – 170 ° C, 200 ° C, and 230 ° C for up to 1500 hours and the oxidation growth is documented as a function of aging duration and temperature using a fluorescence microscope; (2)使用全氧化标本对氧化EMC(Viz。,弹性模量,热膨胀系系和玻璃过渡温度)的批判性热机械性能进行了实验表征; (3)通过将热老化套件的变形与在治疗周期下的原始包装的变形进行比较,研究了EMC氧化对电子包装的热机械行为的影响。这项研究表明,EMC在暴露于高温的早期(≈24小时)中迅速氧化,氧化层表现出明显不同的热力学特性。因此,热老化发展了较硬的包装行为,这对于准确的可靠性评估至关重要。