7.1. 应用电路................................................................................................................17 7.2. 建议 PCB 封装尺寸....................................................................................................18 7.3. 天线布局要求...............................................................................................................18 7.4. 电源.......................................................................................................................19 7.5. GPIO......................................................................................................................20 8. 存储条件.......................................................................................................................21 9. 回流焊曲线图....................................................................................................................21 10. 产品包装信息....................................................................................................................22 11. 联系我们....................................................................................................................................22 免责声明和版权声明.........................................................................................................................23 声明.....................................................................................................................................23
主要关键词