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o M. N. Sabry，“对流介质的紧凑热模型”，Proc。International Workshop on Thermal Investigation of ICs and Systems (THERMINIC 24-26 September), Aix-En-Provence, France, 2003, 99-105 o M. N. Sabry , "Compact Thermal Models for Electronic Systems," IEEE Transactions on Components and Packaging Technologies , 26, 1, IEEE , DOI: 10.1109/TCAPT.2002.808009, 2003 o M. N. Sabry，“用于电子设计的动态紧凑热模型：最近进度的评论”，Proc。IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui, Hawaii, USA , 2003, IPACK2003, 35185, 1-17, ASME, DOI: 10.1115/ipack2003-35185 o C. Lasance, and M. N. Sabry, "The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models," Proc。IPACK03国际电子包装技术会议和展览，2003年7月6日至11日，毛伊岛，夏威夷，美国，2003年，ipack2003，35167，1-8，ASME，DOI：10.1115/ipack2003-35167
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