Shorts, opens, minimum line/space violations, nicks, protrusions, dish downs, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, laser via defects as missing drill, over drill, under drill, via shift, residue在Via中,通过大小和形状