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3。Oxidation 75–102 3.1 Introduction 75 3.2 Growth and Kinetics 78 3.2.1 Dry Oxidation 79 3.2.2 Wet Oxidation 80 3.3 Growth Rate of Silicon Oxide Layer 82 3.4 Impurities effect on the Oxidation Rate 87 3.5 Oxide Properties 89 3.6 Oxide Charges 90 3.7 Oxidation Techniques 92 3.8 Oxide Thickness Measurement 92 3.9 Oxide Furnaces 95 3.10摘要98问题98参考99 4。Lithography 103–138 4.1 Introduction 103 4.2 Optical Lithography 105 4.3 Contact Optical Lithography 106 4.4 Proximity Optical Lithography 106 4.5 Projection Optical Lithography 107 4.6 Masks 112 4.7 Photomask Fabrication 114 4.8 Phase Shifting Mask 115 4.9 Photoresist 116 4.10 Pattern Transfer 119 4.11 Particle-Based Lithography 122 4.11.1 Electron Beam Lithography 122 4.11.2电子互动124 4.12离子束光刻127 4.13超紫色光刻129 4.14 X射线光刻130 130 4.15光刻技术的比较132 4.16摘要133问题133问题139参考139
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