机构名称：
¥ 1.0
Detected Defects Shorts, opens, minimum line/space violations, nicks, protrusions, dishdowns, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, defects in through blind vias
超大300
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