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¥ 1.0
Attendees are invited to visit YINCAE's booth to explore the company's cutting-edge innovations in board-level assembly materials, underfill, die attach adhesives, wafer-level materials, optoelectronic materials, and thermal interface materials.YINCAE's team of experts will be available to discuss how its solutions address the evolving needs of the semiconductor and microelectronics market, with applications spanning automotive, military, aerospace, consumer electronics, telecommunications (e.g., 5G/6G), and AI.
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