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DNA折纸铰链融合的自我修复水凝胶
Figure 1 – Schematic of wound healing in humans ........................................................ 3 Figure 2 – Schematic on DNA hairpin-based shape memory hydrogel............................ 5 Figure 3 – Schematics on how different studied self-healing systems work..................... 7 Figure 4 – DNA structure and the complementary base-pairing system ........................ 10 Figure 5 – Examples of DNA nanotechnology构造........................................................................................................................................................................................................................................................................................................................................................................................................................................................... 13图7 - 3D DNA折纸曲柄滑块结构.................................................to attach the DNA oligonucleotide crosslinks to the pAA chain ........................................................................................ 17 Figure 10 – Schematic illustrating how a free radical polymerization progresses........... 18 Figure 11 – DNA hairpin-dependent expansion of the pAA hydrogels in the 2017 study by Schulman et al................................................................................................................................................................................................................................................................................ 19图12 - PAA聚合反应的示意图............................................................................................................... 60分钟后的水凝胶形成.... 28图16 - 优化的PAA-SSDNA水凝胶............................................................................................................................................................................................... 29图17 - 对PAA凝胶优化的不同冷却设置的定性分析结果的结果.................................................................................................................................................................................................................................................................................反应混合物中存在的ssdna ................................................................................................................................................................................................................................................................................................................................................................................................................................. 30
添加剂制造的图像分析方法...
Figure 1- Flowchart of typical Additive manufacturing .............................................................. 1 Figure 2 – Schematic representation of the gas turbine [1]........................................................ 3 Figure 3 – Schematic explanation of the PBF process with Laser and Electron beam as the energy source [5]............................................................................................................................... 6 Figure 4 – Schematic explanation of DED [33]...............................................................................................................................................................................................................................................................................................................................................................................................粘合剂喷射[6] ................................................................................................................................................................... - 图像分析中的方法[11]。.................................................................................. 13 Figure 9 - Symbolic expression of Image processing................................................................ 14 Figure 10 - Flowchart of the Automated Image Analysis [11] ................................................. 18 Figure 11 - MIPAR software ......................................................................................................... 20 Figure 12 – Image J software ........................................................................................................ 22 Figure 13 – Grain size measurement objective .......................................................................... 23 Figure 14 – Defect Analysis Objective ........................................................................................ 23 Figure 15 – Manual measurement of defect Analysis ................................................................ 25 Figure 16 – MIPAR recipe ……................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................... Defect Analysis measurement .................................................................................. 30 Figure 21 – Porosity defect analysis plot ..................................................................................... 31 Figure 22 – Stitched image of the entire sample.
CA-IS3115AW隔离DC- ...
1。Introduction .................................................................................................................................................................... 2 2.emi优化的设计....................................................................................................................................................................................................................................................................................... 2 2.1。CA-IS3115AW General Description ....................................................................................................................................... 2 2.2.EMI Filter and Component Placement .................................................................................................................................. 3 2.2.1.Decoupling Capacitor Placement ......................................................................................................................3 2.2.2.Y-capacitor ........................................................................................................................................................4 2.2.3.Ferrite Bead/Common-mode Inductor/Differential-mode Inductor ................................................................4 2.2.4.Building the edge guarding ...............................................................................................................................5 3.CA-IS3115AW Reference Designs ................................................................................................................................... 6 3.1.CA-IS3115AW Reference Design Schematic (2-layer PCB) ................................................................................8 3.2.3.Reference Design Overview .................................................................................................................................................. 6 3.2.2-layer PCB with CM-choke on Board ................................................................................................................................... 6 3.2.1.PCB Layout Procedure .......................................................................................................................................6 3.2.2.Reference Design Test Result for the 2-layer PCB .............................................................................................8 3.3.4-Layer PCB with CM-choke on Board ................................................................................................................................. 10 3.3.1.PCB Layout Procedure .....................................................................................................................................10 3.3.2.CA-IS3115AW Reference Design Schematic(4-layer PCB) ...............................................................................12 3.3.3.Reference Design Test Result for the 4-layer PCB ...........................................................................................12 3.4.4-Layer PCB without CM-choke on Board ........................................................................................................................... 14 3.4.1.PCB Layout Procedure .....................................................................................................................................14 3.4.2.CA-IS3115AW Reference Design Schematic (4-layer PCB) ..............................................................................16 3.4.3.Reference Design Test Result for the 4-layer PCB ...........................................................................................16 4.Revision History ............................................................................................................................................................ 18 5.Important Statement .................................................................................................................................................... 18
UM-B-162：DA14695 SmartBond模块开发套件
Figure 1: DA14695 SmartBond module DB...............................................................................4 Figure 2: DA14695 SmartBond module DEVKIT........................................................................5 Figure 3: Component description – top side ..............................................................................6 Figure 4: Component description – bottom侧面............................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................... button on DA14695 SmartBond module DB........................................................9 Figure 9: General purpose LED on DA14695 SmartBond module DB ......................................... 10 Figure 10: CIB (JTAG/UART interface) connector (J4) ............................................................. 10 Figure 11: Schematic of DA14695 SmartBond module DB [331-39-B], Page 1 ............................. 11 Figure 12: Schematic of DA14695 SmartBond module DB [331-39-B], Page 2 ............................. 12 Figure 13: Components on top/bottom side for DA14695 SmartBond module DB [331-39-B].......... 13
水上的太阳革命
List of Figures Figure 1: Schematic of an FPV system 8 Figure 2: Schematic of a Floating Platform 9 Figure 3: Schematic of an Anchoring and Mooring System 10 Figure 4: UP Solar Energy Target 13 Figure 5: Year-on-Year solar installed capacity in UP 14 Figure 6: Approvals necessary to set up an FPV project 17 Figure 7: GIS image representations for water boundary extraction in Lalitpur and Sonbhadra districts 20 Figure 8: GIS image representations for depth estimation in Lalitpur and Sonbhadra districts 21 Figure 9: District-wise distribution of water bodies in UP 22 Figure 10: FPV potential varying by water body coverage 23 Figure 11: District-wise FPV deployment potential (in MW) by varying percentages of water body coverage (20%, 25% and 30%, clockwise) 24 Figure 12: GIS image representations for proximity analysis to road networks in Lalitpur and Sonbhadra districts 25 Figure 13: Number of water bodies connected to a road network (< 2.5 km distance) 25 Figure 14: GIS image representation of water bodies located in protected areas 26 Figure 15: FPV potential of water bodies inside protected areas 27 Figure 16: Annual expected energy generation of FPV systems by varying probability of realisation and water body coverage 29 Figure 17: Monthly generation of FPV system varying by tilt angle and水体覆盖率29
高级粗太阳传感器技术规范，...
图1。ACSS sun sensor device ........................................................................................................................... 5 Fig 2.ACSS schematic ........................................................................................................................................ 5 Fig 3.Labeling ..................................................................................................................................................... 8 Fig 4.Angles reference ....................................................................................................................................... 8 Fig 5.Mechanical interface .................................................................................................................................. 9 Fig 6.Electrical interface ................................................................................................................................... 11 Fig 7.Signal acquisition recommended............................................................................................................. 11 Fig 8.Connector pin numbering ........................................................................................................................ 12 Fig 9.Spectral Responsivity .............................................................................................................................. 13 Fig 10.Sensor response of nominal and redundant units of ACSS .................................................................. 14 Tables
南澳大利亚DEX项目最终知识共享报告南澳大利亚DEX项目最终知识共享报告
Figure 1 – Historic Solar PV Market Penetration by State ....................................................................... 10 Figure 2 – Historic SA Average Grid Demand Profile in October ............................................................. 11 Figure 3 – Summary of CER Implementation Plan Reforms Across the Supply Chain .......................... 12 Figure 4 – The deX Project CER Marketplace Portal Schematic ............................................................. 16 Figure 5 – Project Participants .................................................................................................................. 17 Figure 6 – Overview of SAPN Registered Assets via the GreenSync deX Portal .................................... 20 Figure 7 – deX Project Timeline ................................................................................................................ 21
设计，制造，优化和characte-中庭
图1.1 - AM零件的照片：（a）推进器歧管，该歧管展示了形成内部途径和空腔的能力； （b）晶格立方体，既展示了AM的重量减轻和强度能力； （c）由钛制造的钥匙扣。这些照片不仅展示了AM的实际方面，还展示了该技术的艺术可能性。............................................................................................... 1 Figure 2.1 – Graph illustrating the different material processing techniques and the time for the interaction [34]... 11图2.2 - 直接激光沉积（DED）系统的示意图。......................................................................... 11 Figure 2.3 – A detailed schematic of a direct energy deposition (DED) system......................................................... 12 Figure 2.4 – Schematics of early patents used for the development of a coaxial head: (a) Gale et al.[24]，（b）Schaefer等。[25]和（c）Livsey等。[27]。............................................................................................................. 13 Figure 2.5 – Patents of coaxial nozzle designs for comparative purposes: (a) Hammeke [28] and (b) Buongiorno [30]............................................................................................................................................................................... 14 Figure 2.6 – Simplified schematic for a coaxial head with two configurations: axial spray (left) and side spray (right) [33]............................................................................................................................................................................... 16 Figure 2.7 – Mapping of the parameters and the operating region for an DED design [51]....................................... 17 Figure 2.8 – Visual aid of a proposed beam routing system exaggerating the Gaussian profile...................................................................................................................................................................................................................................................................................................................................................................................................... reseation图证明了辐射的不同材料与波长的反射率[34]。.............................................................................................................................................................................. 20 Figure 2.10 – Early powder delivery patent schematics by Kenneth [81]................................................................... 23 Figure 3.1 – Design algorithm for DED machine design used to as a final check for the BenchDED....................... 30 Figure 3.2 – The experimental setup used in the development of the preliminary laser system.此实验设置用于确定使用两镜头配置与200瓦ND ND：YAG模块结合使用的最大点大小。The system was designed to be horizontal so that the substrate could be moved to the waist of the beam.................................................................................................................................................... 34 Figure 3.3 – Mirror beam routing system for DED............................................................................... 46 Figure 3.14 – Final design used in the research..................................................................................................... 35 Figure 3.4 – Fiber coupling systems............................................................................................................................ 36 Figure 3.5 – Schematic and photo of the first PDS prototype..................................................................................... 40 Figure 3.6 – Photos of a powder delivery system with pneumatics............................................................................. 41 Figure 3.7 – Photo of a mounted powder delivery system that used gravity to provide a consistent powder flow..... 41 Figure 3.8 – Schematic of the CAD coaxial nozzle..................................................................................................... 43 Figure 3.9 – 3D printed coaxial nozzle mock-up......................................................................................................... 43 Figure 3.10 – Testing optical assembly........................................................................................................................ 44 Figure 3.11 – Final optical assembly design................................................................................................................ 44 Figure 3.12 – Exploded view of the aluminum CNC manufactured coaxial nozzle.................................................... 45 Figure 3.13 – 2D side view of the coaxial nozzle CAD assembly........................................................................................................... 46 Figure 4.1 – Compiled and labeled photos of the BenchDED setup........................................................................... 51 Figure 4.2 – Optical microscope images at a magnification of x250 for varying the laser power density on SS316 substrates...................................................................................................................................................................... 55 Figure 4.3 – Localized vaporization of material experiments, with (a) showing a magnification of Figure 4.2 (d) and (b) showing a magnification of Figure 4.2 (e)............................................................................................................. 56 Figure 4.4 – Graph of melt pool diameter development in relation to power density................................................. 57 Figure 4.5 – The result of different scanning speeds and laser powers....................................................................... 58 Figure 4.6 – A magnified image of the outermost track from scanning rate experiments for a laser power of 125 W and scanning speeds of 50 mm/sec (left) and 200 mm/s (right).................................................................................. 59 Figure 4.7 – A comparison of the real images, versus the topology and depth mapping............................................ 60 Figure 4.8 – Optical images used to analyze the multi-pass deposition results........................................................... 61 Figure 5.1 – A photograph of the BenchDED chamber.绿色来自保护玻璃，该防护玻璃阻塞了所有红外辐射。............................................................................................. 69......................................................................................................................................................... 66 Figure 5.2 – Schematic of BenchDED G code toolpath.
