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奥宝科技 Precise™ 800
* 其他层压板需要由 KLA 测试 ** 较大尺寸的短路可在聚合模式下成形 *** 基于带有 FR4 层压板的测试面板，包括 L/U **** 取决于缺陷数量和分布 ***** 取决于导体的尺寸、方向和厚度。Orbotech Precise Stick 消耗量可能存在很大差异。
超大300
Detected Defects Shorts, opens, minimum line/space violations, nicks, protrusions, dishdowns, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, defects in through blind vias
Orbotech Ultra Fusion™200
Detected Defects Shorts, opens, minimum line/space violations, nicks, protrusions, dishdowns, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, defects in through blind vias
融合22
Detected Defects Shorts, opens, minimum line/space violations, nicks, protrusions, dishdowns, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, defects in through blind vias
Ultra Filter 700
Shorts, opens, minimum line/space violations, nicks, protrusions, dish downs, copper splashes, pinholes, missing or excess features, wrong size and position of features, clearance and split plane violations, blocked holes, annular ring violations, SMT violations, black spots, wire bonding pad defects, flip chip pad defects, laser via defects as missing drill, over drill, under drill, via shift, residue在Via中，通过大小和形状