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• Separating, drilling, structuring of glass wafers and panels with different glass materials • Processing of optical devices • Generation of micro fluidic channels for medical, biological, chemical applications in glass, metal or ceramic materials • Laser Lift-Off (LLO) of glass and sapphire substrates for the semiconductor industry, as well as for production of organic light-emitting diodes (OLEDs) and microLED-displays •基于透明玻璃基板的柔性电子系统的激光升级（LLO）•柔性电气系统的激光处理，例如在医疗设备和传感器领域使用卷到卷过程•为流体应用制造微钻，例如喷墨打印喷嘴，只有几微米的钻孔直径和定义的孔几何形状
从想法到产品-3D -Micromac
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