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Febby Krisnadi，Ankit博士，Mohit Rameshchandra Kulkarni博士，助理。 Prof. Nripan Mathews School of Materials Science and Engineering Nanyang Technological University, Singapore E-mail: nripan@ntu.edu.sg Linh Lan Nguyen Chemistry and Biological Chemistry, School of Physical and Mathematical Sciences Nanyang Technological University, Singapore Dr. Jinwoo Ma, Prof. Michael David Dickey Department of Chemical and Biomolecular Engineering North Carolina State University, Raleigh, North美国卡罗来纳州，电子邮件：mddickey@ncsu.edu Assoc。 Nripan Mathews能源研究所教授 @ ntu（eri @ n）Nanyang Technological University，新加坡＃这些作者为这项工作做出了同样的贡献。 关键字：软电子，egain，电介型，定向组装，自我修复Febby Krisnadi，Ankit博士，Mohit Rameshchandra Kulkarni博士，助理。Prof. Nripan Mathews School of Materials Science and Engineering Nanyang Technological University, Singapore E-mail: nripan@ntu.edu.sg Linh Lan Nguyen Chemistry and Biological Chemistry, School of Physical and Mathematical Sciences Nanyang Technological University, Singapore Dr. Jinwoo Ma, Prof. Michael David Dickey Department of Chemical and Biomolecular Engineering North Carolina State University, Raleigh, North美国卡罗来纳州，电子邮件：mddickey@ncsu.edu Assoc。Nripan Mathews能源研究所教授 @ ntu（eri @ n）Nanyang Technological University，新加坡＃这些作者为这项工作做出了同样的贡献。关键字：软电子，egain，电介型，定向组装，自我修复
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