摘要:电击环境中MEMS的可靠性是一个复杂的领域,涉及结构动力学,断裂力学和系统可靠性理论等。随着在汽车,物联网,航空航天和其他恶劣环境中使用MEMS的增长,需要深入了解电击环境中MEMS的可靠性。尽管有许多文章的贡献,这些文章概述了MEMS的可靠性,但迄今为止,该审查论文特别关注MEMS的可靠性研究。This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics- system-level reliability, and (vi) the coupling phenomenon of shock with其他因素。本文围绕电击环境中MEMS可靠性的概述填写差距。通过这六个子区域的框架,我们提出了一些可能值得关注的方向来进行未来的研究。
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